Standard Process for Making Advanced Products
Weather your product is standard package or customized module, Imbera's
unique IMB technology enables its manufacture in a cost-efficient way.
This is possible because exactly the same materials, equipment and process
are used as when making ordinary PCB's. A wide supply base is available to
us, standard, robust machinery is used and the whole process is geared
towards mass production. The only difference—and your added value provided
by Imbera's know-how—is that components can be embedded in the PCB core,
making the product smaller and more efficient in use.
The component assembly process is determined by component pitch and
required alignment accuracy. Imbera makes the process plan which best
fulfils the requirements and is cost-effective. For small-size and
large-pitch components, such as standard discrete passives the assembly
equipment speed can reach 80,000 UPH. With small pitch advanced components
that require excellent alignment accuracy, the assembly is carried out with
the equipment having even better than 5 µm accuracy – but without
compromising on volume manufacturing opportunities.
The IMB core is manufactured in the same way as a normal PCB core, using
standard materials. Pressing is performed using standard high-volume HDI
multilayer vacuum presses that allow a very planar and voidless structure.
Components that are located in the “pockets” of core material don’t
experience any pressure during pressing process. Completed cores can be
used like conventional cores in normal PCB processes, sometimes followed
by additional surface mounting procedures.
Outer layer manufacturing
IMB technology allows the use of many kinds of PCB outer layer
manufacturing processes. Depending on the final requirements of the
product, additive, semi-additive or subtractive processes can also be
employed. Since an IMB core can be used like a normal PCB core, all normal
HDI PWB multilayer structures (for example, 1+2+1, 2+2+2, 1+4+1, 2+4+2) can
Thus, Imbera's superior technology enables embedding for advanced
applications, yet the produced core behaves exactly like any other core in
further processing. In this way, existing PCB supply base can be utilized.