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Imbera licenses its versatile embedded packaging IP to Ibiden

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Press Release
Espoo, Finland, 17th September 2008

World’s largest PCB producer to reap the miniaturisation, electrical performance and cost benefits of integrated module board (IMB) technology

Imbera Electronics Ltd, today announces that Ibiden, the world’s largest PCB producer, has signed a 5-year deal to license the company’s integrated module board (IMB) technology. This innovative embedded packaging technology will enable Ibiden to offer its clients a robust and cost effective miniaturization solution with the versatility to support a wide range of product applications. Ibiden has already had interest in Imbera’s solution from one major customer and expects to use IMB technology in a series of projects going forward.

Jeff Baloun, CEO at Imbera commented: “Partnering with the number one PCB house in the world is great kudos for Imbera and proves to the industry how well our technology works in a production setting. This deal will help us to achieve significant recognition in the industry and enable others to see IMB’s great potential to satisfy the electronics market’s requirement for thinner, smaller products with enhanced electrical performance and functionality. Working closely with Ibiden presents Imbera with a huge opportunity to build up future business with its global, high volume mobile handset and semiconductor clients.”

Sotaro Ito, PWB Division Manager at Ibiden said: “Imbera’s robust IMB technology gives us the ability to reduce the size of products whilst improving the cost of ownership. The process is very easy to adopt, versatile, simple in concept and offers a route to future reductions. This gives Ibiden a vital edge in this highly competitive industry. We’re excited by the potential opportunities ahead.”

Imbera’s technology allows OEMs/ODMs to produce smaller boards, quickly and in a cost-effective manner by making simple adaptations to existing manufacturing processes. Unlike traditional surface mount technology (SMT), IMB technology embeds components inside an organic substrate. Using the technology it is possible to embed all kinds of components including discrete passive components, application specific integrated passive (ASIP) components, bare dies (Silicon, GaAs) and wafer level CSPs. Imbera’s manufacturing process combines PCB manufacturing, component packaging and component assembly into a single manufacturing sequence. The benefit of this shortened process means less materials and equipment are needed, logistics are simplified and less labour is required. All this leads to a robust technology that provides further product miniaturization with very competitive total cost of ownership.

Due to its novel and advanced manufacturing process, IMB technology can be used to embed components inside a module substrate and manufacture a typical multi-chip-module / System-In-Package (SIP) product. Alternatively IMB technology can also be used to embed the components inside a motherboard to manufacture a System-In-Board (SIB) product. The technology can be utilized in various applications from simple products with only a few components to demanding products, such as mobile phones and other portable products requiring high packaging density as well as good electrical and thermal performance.

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About Imbera
Imbera Electronics is the developer the novel patented IMB - Integrated Module Board – technology, which enables the integration of both active and passive components inside an organic printed circuit board structure. The key advantages of the IMB technology are further product miniaturization and improved electrical performance as well as competitive total manufacturing cost level. Also, the IMB technology can be combined with existing PCB production processes without extensive development work, which enables fast technology ramp-up and high production quality.

About Ibiden
IBIDEN is one of world-top providers of printed wiring boards (PWB) and fine ceramics, having production bases around the world and keep a significant market share especially in PWB for mobile phone and IC package for PC.
Mobile electronics market is the ever-changing market that demands not only smaller and thinner device but also higher functions.

IBIDEN keeps moving forward in supplying world-leading products with highly advanced technologies that have been accumulated for years but yet to be further developed by mixing themselves.

Chris King / Alex Perryman
Tel: +44 (0) 208 408 8000

Jeff Baloun
Tel: +1 321 543 9996

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