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Tuominen, Risto, Palm, P., “Development of industrial scale manufacturing line for Integrated Module Board technology”, IEEE VLSI Packaging Workshop, November 2002, Kyoto, Japan

Palm, Petteri, Tuominen, R., “Embedding Active Components Inside Organic Substrate using IMB Technology”, IMAPS Nordic 2003 Conference, September 2003, Helsinki, Finland

Palm, Petteri, Tuominen, R., ”Industrial Scale Manufacturing Process for Embedding Active Components Inside Organic Substrate”, The Proceedings of 36th International Symposium on Microelectronics (IMAPS), November 2003, Boston, USA

Palm, Petteri, Tuominen, R., Kivikero, A., “Integrated Module Board (IMB) technology: Manufacturing Process and Electrical Properties of IMB Interconnection”, Advancing Microelectronics, Advancing Microelectronics, vol. 31, no. 1 (Jan 2004)

Palm, Petteri, Tuominen, R., Kivikero, A., “Integrated Module Board (IMB); an Advanced Manufacturing Technology For Embedding Active Components Inside Organic Substrate”, ECTC 2004, The 54th Electronic Components and Technology Conference, June 2004, Las Vegas, USA

Palm, Petteri, Tuominen, R., Karila, T., Kivikero, A., “Advanced Manufacturing TechnologyFor Embedding Active Components Inside Organic Substrate”, Imaps Nordic conference 2004, September 2004, Helsingør, Danmark

Tuominen, Risto, Karila, T., Kivikero, A., Palm, P., “Improving Integrated Module Board Efficiency – Current Development in Imbera Electronics”, IEEE VLSI Packaging Workshop, November 2004, Kyoto, Japan

Palm, Petteri, Moisala, J., Kivikero, A., Tuominen, R., Iihola, A., “Embedding Active Components Inside Printed Circuit Board (PCB) - a Solution for Miniaturization of Electronics”, IEEE Advanced Packaging Materials Symposium, March 2005, Irvine, USA

Rapala-Virtanen, Tarja, Perälä, P., Tuominen, R., Palm, P., “Embedding passive and active components in PCB- solution for miniaturization”, Electronic Circuit World Convention 10, February 2005, Anaheim, USA

Tuominen, Risto, Kivikero, A., Moisala, J., Palm, P., “Novel 3rd generation Integrated Module Board (IMB) technology to embed active components inside PCB structure”, ICEP, April 2005, Tokyo, Japan

Tuominen, Risto, “Embedding Discrete Components into Organic Substrates”, ICEP, 2006, Tokyo, Japan

Karila, Tanja, “Thermal Performance of the Embedded IC Structure”, EMPC 2007- the 16th European Microelectronics and Packaging Conference & Exhibition, June 2007, Oulu, Finland

Palm, Petteri, “Embedding active and passive components inside organic 3D module”, 2nd International Workshop “3D System Integration”, October 2007, Munich, Germany

Waris, Tuomas, “Further Miniaturization Utilizing IMB Technology”, MEPTEC 2007, November 2007, San Jose, California, USA

Waris, Tuomas, “Using IMB Technology to Embed Discrete Components”, Z-DAC 2007 November 2007, Bonn, Germany

Waris, Tuomas, “Embedded Discrete components Using IMB Technology”, TechSearch Embedded Components Workshop, February 2008, Austin, Texas, USA

Karila, Tanja, Palm, P., “Thermal Characteristics of Integrated Module Board”, 24th Semiconductor Thermal Measurement and Management Symposium - Semi-Therm 2008, March 2008, San Jose, California, USA

Waris, Tuomas, Karila, T., Kujala, A., Hildén, P., "Embedded Discrete Passive Components in PCBs using IMB Technology", The 22nd CARTS Europe Conference, October 2008, Helsinki, Finland

Waris, Tuomas, "How to embed standard active and passive components into a PCB", Electronica 2008, November 2008, Munich, Germany

Tuominen, Risto, Waris, T., Mettovaara J., "IMB Technology for Embedded Active and Passive Components in SiP, SiB and Single IC Package Applications", ICEP 2009, April 2009, Kyoto, Japan

Tuominen, Risto, "Component Embedding with Integrated Module Board Technology", ISMP 2009, October 2009, Ilsan, Korea

Tessier, Theodore (Ted) G., Karila Tanja (IMBERA), Waris T. (IMBERA), Dhaenens M., and Clark D., Laminate Based Fan-Out Embedded Die Technologies: The Other Option, International Wafer-Level Packaging Conference IWLPC 2010, Santa Clara, CA